ADLINK Launches the ‘DLAP Supreme’ Series
Accelerating Generative AI Deployment at the EdgeSummary: TAIPEI, Taiwan — January 15, 2025 — ADLINK Technology Inc., a global leader in edge computing, unveiled its new “DLAP Supreme Series”, an…
ArcherMind Technology and Arraymo Unveil AI+OS Integration at CES 2025, Pioneering a New Era of Digital Intelligence
LAS VEGAS, Nev. — January 13, 2025 — From January 7th to 10th, 2025, the International Consumer Electronics Show (CES 2025) was held in Las Vegas, USA. ArcherMind Technology and…
DeGirum Delivers AI Hub to Accelerate Edge AI Development
Supports Leading Accelerators and AI Edge Processors with 1000+ Available Models SANTA CLARA, Calif. — January 13, 2025 — DeGirum®, a leader in edge AI software, announced the release of…
Aetina Works with Qualcomm to Advance Edge AI with Groundbreaking On-Prem Solutions
TAIPEI, Taiwan — January 10, 2025 — Aetina Corporation, a leading provider of edge AI solutions and a subsidiary of Innodisk Group, today announced a collaboration with Qualcomm Technologies, Inc.,…
Mobilint Unveils LLM Demo on High-Efficiency Edge AI Accelerator at CES 2025
SEOUL, South Korea — January 8, 2025 — Mobilint, a leading South Korean fabless edge AI chip startup, showcased a live demonstration of a large language model (LLM) inferencing in…
Innatera Showcases Revolutionary Neuromorphic Processor Enabling Next-Generation Ambient Intelligence at CES 2025
Delft University of Technology spin-off’s Spiking Neural Processor utilizes a proprietary analog-mixed signal computing architecture that harnesses spiking neural networks to deliver unprecedented, brain-inspired cognition performance within an ultra-low power…
Ambarella Expands N1 Edge GenAI Family With SoC Targeted at On-Premise Multi-Channel VLM and NN Processing in Under 20 Watts
New AI SoC is Ideal for On-Premise AI Boxes, Autonomous Robotics and Smart City Security; Brings High-Performance GenAI to Power- and Cost-Constrained Edge AI Applications SANTA CLARA, Calif. — January…
Fibocom Launches the Fibocom AI Stack to Facilitate On-device AI Deployment with a Fully Manageable Service at CES 2025
LAS VEGAS, Nev. — January 7, 2025 — Fibocom (Stock code: 300638), a global leading provider of AIoT solutions and wireless communication modules, announces its brand-new Fibocom AI Stack, an…
QuickLogic Announces Strategic Process for SensiML
SAN JOSE, Calif. — January 7, 2025 — QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP and ruggedized FPGAs, today announced its Board of Directors is…
Ceva Expands Embedded AI NPU Ecosystem with New Partnerships That Accelerate Time-to-Market for Smart Edge Devices
– Cyberon and AIZIP collaborate with Ceva to offer pre-optimized AI models for Ceva-NeuPro-Nano Embedded AI NPUs including keyword spotting, face recognition and speaker identification – Expanded collaboration with Edge…